Semiconductor device structure with magnetic element

ABSTRACT

A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a magnetic element over the substrate. The semiconductor device structure also includes an isolation element over the magnetic element. The i magnetic element is wider than the isolation element. The semiconductor device structure further includes a conductive line over the isolation element.

PRIORITY CLAIM AND CROSS-REFERENCE

This application is a Continuation application of U.S. patentapplication Ser. No. 16/907,699, filed on Jun. 22, 2020, which is aContinuation application of U.S. patent application Ser. No. 16/260,439,filed on Jan. 29, 2019, which claims the benefit of U.S. ProvisionalApplication No. 62/691,108, filed on Jun. 28, 2018, the entirety ofwhich are incorporated by reference herein.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experienced rapidgrowth. Technological advances in IC materials and design have producedgenerations of ICs. Each generation has smaller and more complexcircuits than the previous generation.

In the course of IC evolution, functional density (i.e., the number ofinterconnected devices per chip area) has generally increased whilegeometric size (i.e., the smallest component (or line) that can becreated using a fabrication process) has decreased. This scaling-downprocess generally provides benefits by increasing production efficiencyand lowering associated costs.

However, these advances have increased the complexity of processing andmanufacturing ICs. Since feature sizes continue to decrease, fabricationprocesses continue to become more difficult to perform. Therefore, it isa challenge to form reliable semiconductor devices at smaller andsmaller sizes.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It shouldbe noted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1A-1I are cross-sectional views of various stages of a process forforming a semiconductor device structure, in accordance with someembodiments.

FIGS. 2A-2C are cross-sectional views of various stages of a process forforming a semiconductor device structure, in accordance with someembodiments.

FIGS. 3A-3C are top layout views of various stages of a process forforming a semiconductor device structure, in accordance with someembodiments.

FIG. 4 is a cross-sectional view of a semiconductor device structure, inaccordance with some embodiments.

FIG. 5 is a cross-sectional view of a semiconductor device structure, inaccordance with some embodiments.

FIG. 6 is a top layout view of a semiconductor device structure, inaccordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Some embodiments of the disclosure are described. Additional operationscan be provided before, during, and/or after the stages described inthese embodiments. Some of the stages that are described can be replacedor eliminated for different embodiments. Additional features can beadded to the semiconductor device structure. Some of the featuresdescribed below can be replaced or eliminated for different embodiments.Although some embodiments are discussed with operations performed in aparticular order, these operations may be performed in another logicalorder.

FIGS. 1A-1I are cross-sectional views of various stages of a process forforming a semiconductor device structure, in accordance with someembodiments. As shown in FIG. 1A, a semiconductor substrate 100 isreceived or provided. The semiconductor substrate 100 may include asemiconductor wafer with multiple device elements formed therein. Forexample, the semiconductor substrate 100 is a silicon wafer withtransistors formed therein.

In some embodiments, an interconnection structure 102 is formed over thesemiconductor substrate 100. The interconnection structure 102 mayinclude multiple dielectric layers and multiple conductive features.These conductive features form electrical connections between the deviceelements and other elements to be formed later. In some embodiments, thetopmost dielectric layer of the interconnection structure 102 is made ofor includes a polymer material. For example, the polymer material ispolyimide or another suitable material.

As shown in FIG. 1A, a protective layer 104 is deposited over theinterconnection structure 102, in accordance with some embodiments. Theprotective layer 104 may be used to protect the interconnectionstructure 102 during a subsequent etching process for improving thequality of magnetic elements. In some embodiments, the protective layer104 is a single layer. In some other embodiments, the protective layer104 includes multiple sub-layers. The sub-layers may be made of the samematerial. Alternatively, some of the sub-layers are made of differentmaterials.

The protective layer 104 may be made of or include silicon nitride,silicon oxide, silicon oxynitride, silicon carbide, one or more othersuitable materials, or a combination thereof. The protective layer 104may be deposited using a chemical vapor deposition (CVD) process, anatomic layer deposition (ALD) process, a physical vapor deposition (PVD)process, a spin-on process, one or more other applicable processes, or acombination thereof.

The protective layer 104 may have a thickness that is in a range from0.1 μm to about 3 μm. In some cases, if the protective layer 104 isthinner than about 0.1 μm, the protective layer 104 may be too thin andnot be able to protect the interconnection structure 102 thereunder. Insome other cases, if the protective layer 104 is thicker than about 3μm, the stress of the protective layer 104 may be too high. Theprotective layer 104 may be broken or delaminated due to the highstress, which may negatively affect the quality and reliability of thesemiconductor device structure.

As shown in FIG. 1A, an etch stop layer 106 is deposited over theprotective layer 104, in accordance with some embodiments. The etch stoplayer 106 may protect the protective layer 104 and the interconnectionstructure 102 thereunder from being damaged during a subsequent etchingprocess for forming magnetic elements. In some embodiments, the etchstop layer 106 is a single layer. In some other embodiments, etch stoplayer 106 includes multiple sub-layers. The sub-layers may be made ofthe same material. Alternatively, some of the sub-layers are made ofdifferent materials.

In some embodiments, the etch stop layer 106 and the protective layer104 are made of different materials. The etch stop layer 106 may be madeof or include tantalum oxide, zirconium oxide, tantalum nitride, one ormore other suitable materials, or a combination thereof. In some otherembodiments, a metal layer is deposited over the interconnectionstructure 102. Afterwards, an oxidation process and/or a nitridationprocess are used to transform the metal layer into the protective layer104.

As shown in FIG. 1A, two or more magnetic layers (such as magneticlayers 108 a-108 e) are sequentially deposited over the etch stop layer106, in accordance with some embodiments. These magnetic layers 108a-108 e will be patterned later to form one or more magnetic elements.In some embodiments, the magnetic layers 108 a-108 e are made of thesame material. In some other embodiments, some of the magnetic layers108 a-108 e are made of different materials. In some embodiments, eachof the magnetic layers 108 a-108 e has the same thickness. In some otherembodiments, some of the magnetic layers 108 a-108 e have differentthicknesses.

In some embodiments, the magnetic layers 108 a-108 e contain cobalt,zirconium, tantalum, iron, nickel, one or more other elements, or acombination thereof. The magnetic layers 108 a-108 e may be made of orinclude an alloy containing cobalt, zirconium, and tantalum (CZT), analloy containing cobalt and zirconium, an alloy containing iron andnickel, one or more other suitable materials, or a combination thereof.The magnetic layers 108 a-108 e may be deposited using a PVD process, aCVD process, an ALD process, one or more other applicable processes, ora combination thereof.

As shown in FIG. 1B, a patterned mask layer 110 is formed over themagnetic layer 108 e, in accordance with some embodiments. The patternedmask layer 110 is used to assist in a subsequent patterning process ofthe magnetic layers 108 a-108 e. In some embodiments, the patterned masklayer 110 is a patterned photoresist layer. A photolithography processmay be used to form the patterned mask layer 110 with the desiredpattern. For example, the top view of the patterned mask layer 110 mayhave a square shape, a rectangular shape, or another suitable shape.

Afterwards, the magnetic layers 108 a-108 e are partially removed, asshown in FIG. 1B in accordance with some embodiments. As a result, theremaining portions of the magnetic layers 108 a-108 e together form amagnetic element 109. In some embodiments, with the patterned mask layer110 as an etching mask, an etching process is used to partially removethe magnetic layers 108 a-108 e. In some embodiments, the etchingprocess is a wet etching process. The etchant used in the wet etchingprocess may include nitric acid, hydrochloric acid, hydrofluoric acid,one or more other suitable etchants, or a combination thereof. Forexample, a mixture of nitric acid, hydrochloric acid, and hydrofluoricacid is used in the wet etching process. The etch stop layer 106 and theprotective layer 104 may protect the interconnection structure 102 frombeing damaged during the wet etching process for patterning the magneticlayers 108 a-108 e.

In some cases, due to the characteristics of the magnetic layers 108a-108 e and the wet etching process, hollow structures 112 may be formedat sidewalls surfaces of the magnetic element 109, as shown in FIG. 1B.The hollow structures 112 include voids inside, which may negativelyaffect the quality and reliability of the formed magnetic element 109.

As shown in FIG. 1C, a mask element 114 is formed to partially cover thetop surface of the magnetic element 109, in accordance with someembodiments. The material and formation method of the mask element 114may be the same as or similar to those of the patterned mask layer 110.In some embodiments, the magnetic element 109 includes a stack ofmultiple magnetic layers 108 a-108 e. In some embodiments, the topmostmagnetic layer (i.e., the magnetic layer 108 e) is wider than the maskelement 114. In some embodiments, the mask element 114 covers a centerregion R₁ of the topmost magnetic layer 108 e. The topmost magneticlayer 108 e has a periphery region R₂ that is not covered by the maskelement 114 and surrounds the center region R₁ of the topmost magneticlayer 108 e.

Afterwards, an etching process is performed to partially remove themagnetic element 109, as shown in FIG. 1C in accordance with someembodiments. In some embodiments, the etching process is a dry etchingprocess that is capable of removing the hollow structures 112 (includingvoids) at the sidewall surfaces of the magnetic element 109. The etchantused in the dry etching process may include CF₄ or another suitableetchant. In some embodiments, due to the protection of the protectivelayer 104, the dry etching process is performed for a longer period oftime to ensure a complete removal of the hollow structures 112. Sincethe hollow structures 112 are removed, the quality and reliability ofthe magnetic element 109 are improved.

The etching process may also remove residues and/or particles formedduring the formation of the magnetic element 109. In some embodiments,alignment marks are formed in the predetermined dicing region to assistin subsequent patterning processes. For example, a top view of thealignment marks has a triangular profile or a double triangular profile.Due to the etching process, the alignment marks formed on thepredetermined dicing regions are prevented from being covered by theresidues and/or particles. The subsequent alignment processes aregreatly improved. In some other cases where the etching process is notproperly performed, residues and/or particles may be formed on thealignment marks to negatively affect the subsequent patterningprocesses. In some embodiments, after a subsequent dicing process, thealignment marks are removed by the dicing tool.

In some embodiments, the etching process used for removing the hollowstructures 112 also partially remove the etch stop layer 106 and theprotective layer 104. Alternatively, another etching process is used toremove the protective layer 104 or the etch stop layer 106. As a result,a portion of the interconnection structure 102 is exposed, as shown inFIG. 1C in accordance with some embodiments. One or more conductive padsformed in the interconnection structure 102 may be exposed. Otherconductive features such as redistribution layers may be formed later toconnect the exposed conductive pads.

Afterwards, the mask element 114 is removed to expose the top surface109T of the magnetic element 109, as shown in FIG. 1D in accordance withsome embodiments. As shown in FIG. 1D, sidewall surfaces 109S of themagnetic element 109 have stair-like profiles.

FIGS. 3A-3C are top layout views of various stages of a process forforming a semiconductor device structure, in accordance with someembodiments. In some embodiments, FIG. 3A is a top view layout view ofthe structure shown in FIG. 1D. In some embodiments, the structure shownin FIG. 1D is taken along line I-I in FIG. 3A.

In some embodiments, the magnetic element 109 has multiple sub-layerssuch as the magnetic layers 108 a-108 e. In some embodiments, eachsub-layers is larger than another sub-layer above it, as shown in FIGS.1D and 3A. For example, the magnetic layer 108 a is larger than themagnetic layer 108 b. Similarly, the magnetic layer 108 d is larger thanthe magnetic layer 108 e.

As shown in FIG. 1E, an isolation layer 116 is deposited over theinterconnection structure 102 and the magnetic element 109, inaccordance with some embodiments. The isolation layer 116 may be made ofor include silicon nitride, silicon oxide, silicon oxynitride, one ormore other suitable dielectric materials, or a combination thereof. Insome other embodiments, the isolation layer 116 is made of or includes apolymer material. For example, the polymer material is polyimide oranother suitable material. The isolation layer 116 may be depositedusing a CVD process, an ALD process, a spin-on process, a PVD process,one or more other applicable processes, or a combination thereof.

Afterwards, mask elements 117 are formed over the isolation layer 116,as shown in FIG. 1E in accordance with some embodiments. The maskelements 117 are used to assist in a subsequent patterning process ofthe isolation layer 116. The material and formation method of the maskelements 117 may be the same as or similar to those of the mask element114.

As shown in FIG. 1F, the isolation layer 116 is partially removed, inaccordance with some embodiments. The mask elements 117 may be used asan etching mask, and an etching process is used to remove the isolationlayer 116 not covered by the mask elements 117. As a result, theremaining portions of the isolation layer 116 form isolation elements116′, as shown in FIG. 1F.

As shown in FIG. 1G, the mask elements 117 are then removed, inaccordance with some embodiments. In some embodiments, FIG. 3B is a topview layout view of the structure shown in FIG. 1G. In some embodiments,the structure shown in FIG. 1G is taken along line I-I in FIG. 3B. FIGS.2A-2C are cross-sectional views of various stages of a process forforming a semiconductor device structure, in accordance with someembodiments. In some embodiments, the structure shown in FIG. 2A istaken along line J-J in FIG. 3B.

In some embodiments, each of the isolation elements 116′ extends acrossthe magnetic element 109, as shown in FIGS. 1G, 2A, and 3B. In someembodiments, each of the isolation elements 116′ partially covers thetop surface 109T of the magnetic element 109. A portion of the topsurface 109T is not covered by the isolation elements 116′, as shown inFIGS. 1G and 3B. In some embodiments, each of the isolation elements116′ partially covers the sidewall surfaces 109S of the magnetic element109. A portion of the sidewall surfaces 109S is not covered by theisolation elements 116′, as shown in FIGS. 1G and 2A.

As shown in FIGS. 111, 2B, and 3C, conductive lines 118A and 118B areformed over the isolation elements 116′, in accordance with someembodiments. The isolation elements 116′ physically separate themagnetic element 109 from the conductive lines 118A and 118B. In someembodiments, the conductive line 118A extends along an extendingdirection of the isolation element 116′ thereunder. Similarly, theconductive line 118B also extends along an extending direction of theisolation element 116′ thereunder.

In some embodiments, the conductive lines 118A and 118B are electricallyconnected to each other. In some embodiments, the conductive lines 118Aand 118B are electrically connected to other conductive lines formedabove and below the magnetic element 109. These conductive linestogether surround the magnetic element 109. The conductive lines and themagnetic element 109 may together function as an inductor.

The conductive lines 118A and 118B may be made of or include copper,aluminum, gold, cobalt, platinum, one or more other suitable materials,or a combination thereof. In some embodiments, the conductive lines 118Aand 118B are formed using an electroplating process. A seed layer isdeposited first, and then a mask element is formed over the seed layer.The opening of the mask element defines the positions and profiles ofthe conductive lines. Then, one or more conductive material iselectroplated on the exposed portions of the seed layer. Afterwards, themask element is removed, and an etching process is used to remove theseed layer originally covered by the mask element. As a result, theconductive lines 118A and 118B are formed.

Many variations and/or modifications can be made to embodiments of thedisclosure. In some other embodiments, a metal layer is deposited overthe structure shown in FIG. 1G. The metal layer may be deposited using aPVD process, a CVD process, one or more other applicable processes, or acombination thereof. Afterwards, a photolithography process and anetching process are used to pattern the metal layer into the conductivelines 118A and 118B.

In some embodiments, each of the isolation elements 116′ is wider thanthe conductive line 118A or 118B formed thereon, as shown in FIGS. 111and 3C. Therefore, even if an overlay shift occurs during the formationof the conductive lines 118A and 118B, the isolation elements 116′ whichare wider than the conductive line 118A or 118B may still separate themagnetic element 109 from the conductive lines 118A and 118B. Therefore,the magnetic element 109 may still work. In some embodiments, a widthratio of the conductive line 118A or 118B to the isolation element 116′is in a range from about 0.5 to about 0.9. In some cases, if the widthratio is smaller than about 0.5, the resistance of the conductive line118A or 118B may be high. The performance of the magnetic element 109may be negatively affected. In some other cases, if the width ratio isgreater than about 0.9, the risk that the conductive line 118A or 118Bis electrically shorted with the magnetic element 109 may be high. Oncethe conductive line 118A or 118B comes in contact with the magneticelement 109, the magnetic element 109 may not be able to provide desiredfunctions.

As shown in FIG. 3C, a first edge of the conductive line 118A islaterally separated from a first edge of the isolation element 116′ by adistance d₁. A second edge of the conductive line 118A is laterallyseparated from a second edge of the isolation element 116′ located underthe conductive line 118A by a distance d₂. In some embodiments, thedistances d₁ and d₂ are the same. In some other embodiments, thedistances d₁ and d₂ are different from each other. The distance d₁ or d₂may be in a range from about 2 μm to about 4 μm.

In some embodiments, the conductive line 118A (or 118B) and theisolation element 116′ further extend over the interconnect structure102 that is not covered by the magnetic element 109, as shown in FIGS.2B and 3C. As shown in FIG. 3C, an end of the conductive line 118A (or118B) is laterally separated from an edge of the magnetic element 109 bya distance L. In some embodiments, the distance L is in a range fromabout 4 μm to about 6 μm.

In some cases, if the distance L is smaller than about 4 μm, theperformance and quality of the magnetic element 109 may be negativelyaffected. For example, if an overlay shift occurs during the formationof the conductive line 118A (or 118B), the sidewall surface of theisolation element 109 may not be covered by the conductive line 118A (or118B). That is, the conductive line 118A (or 118B) may not extend acrossthe magnetic element 109, which may lead to lower efficiency of themagnetic element 109. In some other cases, if the distance L is greaterthan about 6 μm, stress between the conductive line 118A (or 118B) and asubsequently formed dielectric layer may be increased. There may be arisk that the conductive line 118A (or 118B) would be damaged or broken.

As shown in FIGS. 1I and 2C, a dielectric layer 120 is formed over theconductive lines 118A and 118B, the isolation elements 116′, and themagnetic element 109, in accordance with some embodiments. In someembodiments, the dielectric layer 120 is directly deposited over theconductive lines 118A and 118B, the isolation elements 116′, and themagnetic element 109. In some embodiments, the dielectric layer 120 isin direct contact with the isolation elements 116′, the conductive lines118A and 118B, and the magnetic element 109.

In some embodiments, the dielectric layer 120 is made of or includes apolymer material. The polymer material may include PBO, epoxy resin,polyimide, one or more other suitable materials, or a combinationthereof. The dielectric layer 120 may be formed using a spin-on process,a spray coating process, an injecting process, a molding process, one ormore other suitable processes, or a combination thereof. In someembodiments, the formation of the dielectric layer 120 involves athermal operation. For example, a polymer-containing material is curedat a high temperature to form the dielectric layer 120. Therefore, ahigh thermal stress may be generated during the formation of thedielectric layer 120. As shown in FIG. 3C, the exposed portions of theisolation elements 116′ are minimized, in accordance with someembodiments. The contact area between the isolation elements 116′ andthe dielectric layer 120 is small. The thermal stress applied on theisolation elements 116′ is therefore reduced. The isolation elements116′ and the conductive line 118A (or 118B) thereon are prevented frombeing damaged or broken by the thermal stress from the dielectric layer120. The quality and reliability of the semiconductor device structureas illustrated in FIG. 1I are significantly improved.

Afterwards, multiple material layers and device elements may be formedover the dielectric layer 120. Then, a dicing process may be performedto separate the structure into multiple semiconductor dies or diepackages that are separate from each other.

Many variations and/or modifications can be made to embodiments of thedisclosure. FIG. 4 is a cross-sectional view of a semiconductor devicestructure, in accordance with some embodiments. In some embodiments, theisolation element 116′ conformally extends along the sidewall surfacesof the magnetic element 109. In these cases, both the magnetic element109 and the isolation elements 116′ have stair-like profiles, as shownin FIG. 4.

FIG. 5 is a cross-sectional view of a semiconductor device structure, inaccordance with some embodiments. In some embodiments, FIG. 5 is anenlarged cross-sectional view of the structure shown in FIG. 1C. In someembodiments, after the etching process for removing the hollowstructures 112, portions of the top surface of the topmost magneticlayer 108 e are recessed. As shown in FIG. 5, the magnetic layer 108 ehas a first portion 500A covered by the mask element 114 and a secondportion 500B not covered by the mask element 114. After the etchingprocess, the second portion 500B is recessed to a lower height levelthan the first portion 500A. In some embodiments, a recess 502 isformed. The recess 502 surrounds the first portion 500A.

FIG. 6 is a top layout view of a semiconductor device structure, inaccordance with some embodiments. In some embodiments, the recess 502 isformed due to the etching process for removing the hollow structures112. As shown in FIG. 6, the recess has an edge 501 that defines thefirst portion 500A. As shown in FIG. 6, the recess 501 has a width d₃.In some embodiments, the width d₃ is in a range from about 5 μm to about10 μm.

In some cases, if the width d₃ is smaller than about 5 μm, the etchingprocess for removing the hollow structures 112 may be negativelyaffected. Once an overlay shift occurs during the formation of the maskelement 114, some of the hollow structures 112 may be covered by themask element 114. As a result, the hollow structures 112 may not beremoved completely, which may result in a performance degradation of thesemiconductor device structure.

Embodiments of the disclosure form a protective layer between a magneticelement and a semiconductor substrate. A mask element smaller than themagnetic element is formed to assist in a subsequent etching process ofthe magnetic element. Due to the protection of the protective layer, alonger operation time of an etching process may be performed to removevoids or hollow structures of the magnetic element. The quality of themagnetic element is therefore improved. A patterned isolation elementand a conductive line thereon are formed to extend across and partiallycover the magnetic element. A dielectric layer is then formed over themagnetic element, the patterned isolation element, and the conductiveline. Because the patterned isolation element has a limited contact areato the dielectric layer, the stress between the dielectric layer and thepatterned isolation element is reduced. The patterned isolation elementand the conductive line are prevented from being damaged. The qualityand reliability of the semiconductor device structure are significantlyimproved.

In accordance with some embodiments, a method for forming asemiconductor device structure is provided. The method includes formingan etch stop layer over a semiconductor substrate and forming a magneticelement over the etch stop layer. The method also includes forming anisolation element extending across the magnetic element. The isolationelement partially covers the top surface of the magnetic element andpartially covers sidewall surfaces of the magnetic element. The methodfurther includes forming a conductive line over the isolation element.In addition, the method includes forming a dielectric layer over theconductive line, the isolation element, and the magnetic element.

In accordance with some embodiments, a method for forming asemiconductor device structure is provided. The method includes forminga protective layer and an etch stop layer over a semiconductorsubstrate. The method also includes forming a magnetic element over theetch stop layer and forming a mask element to partially cover a topsurface of the magnetic element. The method further includes performingan etching process to remove voids from sidewall surfaces of themagnetic element. In addition, the method includes forming an isolationelement over the magnetic element and forming a conductive line over theisolation element. The method includes forming a dielectric layer overthe conductive line, the isolation element, and the magnetic element.

In accordance with some embodiments, a semiconductor device structure isprovided. The semiconductor device structure includes a semiconductorsubstrate and a magnetic element over the semiconductor substrate. Thesemiconductor device structure also includes an isolation elementextending across the magnetic element. The isolation element partiallycovers a top surface of the magnetic element and partially coverssidewall surfaces of the magnetic element. The semiconductor devicestructure further includes a conductive line over the isolation element.In addition, the semiconductor device structure includes a dielectriclayer over the conductive line, the isolation element, and the magneticelement.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A semiconductor device structure, comprising: asubstrate; a magnetic element over the substrate; an isolation elementover the magnetic element, wherein the magnetic element is wider thanthe isolation element; and a conductive line over the isolation element.2. The semiconductor device structure as claimed in claim 1, whereinopposite edges of the conductive line are laterally between oppositeedges of the isolation element.
 3. The semiconductor device structure asclaimed in claim 1, wherein the isolation element extends alongsidewalls of the magnetic element.
 4. The semiconductor device structureas claimed in claim 1, wherein the magnetic element comprises multiplesub-layers, and each sub-layers is wider than another sub-layer aboveit.
 5. The semiconductor device structure as claimed in claim 4, whereina topmost sub-layer of the sub-layers has a first portion and a secondportion, the second portion surrounds the first portion, and the firstportion is thicker than the second portion.
 6. The semiconductor devicestructure as claimed in claim 5, wherein the conductive line extendsacross the first portion and the second portion.
 7. The semiconductordevice structure as claimed in claim 1, further comprising a dielectriclayer over the magnetic element and the conductive line.
 8. Thesemiconductor device structure as claimed in claim 7, wherein thedielectric layer is in direct contact with the isolation element, theconductive line, and the magnetic element.
 9. The semiconductor devicestructure as claimed in claim 1, further comprising: a second isolationelement extending across the magnetic element, wherein the secondisolation element partially covers the top surface of the magneticelement and partially covers sidewall surfaces of the magnetic element;and a second conductive line over the second isolation element.
 10. Thesemiconductor device structure as claimed in claim 1, wherein theisolation element is in direct contact with the conductive line.
 11. Asemiconductor device structure, comprising: a substrate; a magneticelement over the substrate; a conductive feature extending across themagnetic element and partially covering the magnetic element; and anisolation element between the conductive feature and the magneticelement, wherein opposite edges of the isolation elements are laterallybetween opposite edges of the magnetic element.
 12. The semiconductordevice structure as claimed in claim 11, wherein opposite edges of theconductive features are laterally between the opposite edges of theisolation element.
 13. The semiconductor device structure as claimed inclaim 11, wherein the magnetic element comprises multiple sub-layers,each sub-layers is wider than another sub-layer above it, a topmostsub-layer of the sub-layers has a first portion and a second portion,the second portion surrounds the first portion, and the first portion isthicker than the second portion.
 14. The semiconductor device structureas claimed in claim 13, wherein the conductive feature extends acrossthe first portion and the second portion.
 15. The semiconductor devicestructure as claimed in claim 13, wherein the second portion has a widthin a range from about 5 μm to about 10 μm.
 16. A semiconductor devicestructure, comprising: a substrate; a magnetic element over thesubstrate; an isolation element over the magnetic element; a conductiveline over the isolation element; and a dielectric layer over theconductive line, the isolation element, and the magnetic element,wherein the dielectric layer is closer to the magnetic element than theconductive line.
 17. The semiconductor device structure as claimed inclaim 16, wherein the dielectric layer is in direct contact with theisolation element and the magnetic element.
 18. The semiconductor devicestructure as claimed in claim 16, further comprising an etch stop layerbetween the substrate and the magnetic element, wherein the etch stoplayer comprises tantalum oxide, zirconium oxide, tantalum nitride, or acombination thereof.
 19. The semiconductor device structure as claimedin claim 16, wherein the isolation element is wider than the conductiveline and narrower than the magnetic element.
 20. The semiconductordevice structure as claimed in claim 16, wherein the dielectric layercovers sidewalls of the magnetic element, the isolation element, and theconductive line.